Three-dimensional structures and related methods of forming three-dimensional structures

ABSTRACT

The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/017,545, filed Feb. 5, 2016, titled “Three-Dimensional Structures andRelated Methods of Forming Three-Dimensional Structures,” which is adivisional of U.S. application Ser. No. 13/355,437, filed Jan. 20, 2012,now U.S. Pat. No. 9,283,642, issued on Mar. 15, 2016, of the same title,the contents of which are incorporated herein by reference in theirentireties for all purposes.

FIELD

The described embodiments relate generally to three-dimensionalstructures. In particular, methods for forming three-dimensionalstructures that may be employed, for example, in the formation ofhousings for electronic devices are disclosed.

BACKGROUND

Components of electronic devices may include a variety ofthree-dimensional structures tailored to the specific purpose for whichthey are employed. In this regard, components may be configured toprovide support to the electronic device, provide protection of internalcomponents from the elements; provide for thermal or acoustictransmission therethrough, or serve one or more various other purposes.The components may also be designed to provide a pleasing look and feel.

While existing components may function sufficiently for the purpose forwhich they are intended, further advances in components definingthree-dimensional shapes and advances in the manufacture thereof may bedesirable. In this regard, further tailoring of shapes to provideadditional functionality and/or simplified manufacture thereof may bedesirable. Accordingly, it may be desirable to provide improvedstructures and improved methods of manufacturing structures.

SUMMARY

The present disclosure generally relates to three-dimensional structuresand related methods for forming the three-dimensional structures. Thethree-dimensional structures may be formed by removing material fromfirst and second surfaces on opposing sides of a body in someembodiments. Example methods of removing material include chemical andlaser etching and machining. For example, a first portion of thematerial may be removed from the first side of the body to define afirst pattern of positive and negative space. Similarly, a secondportion of the material may be removed from the second side of the bodyto define a second pattern of positive and negative space. The firstpattern and the second pattern may combine to form a three-dimensionalstructure. In other embodiments material may be combined (e.g., viacasting or injection molding) or compressed (e.g., via forging) to formthe three-dimensional structures.

The negative space of the first pattern may intersect the negative spaceof the second pattern to define apertures (e.g., through holes) thatextend through the body. The patterns may be configured to defineapertures having desired properties. For example, when a first portionof the aperture formed by the negative space of the first pattern and asecond portion of the aperture formed by the negative space of thesecond pattern extend along parallel axes, linear paths may be definedthrough the three-dimensional structures. In other embodiments the firstportion and the second portion may extend along non-parallel axes.Depending on the configuration thereof, linear or non-linear paths maybe defined through the apertures, which define various optical, thermal,and acoustical properties.

Accordingly, the properties of the three-dimensional structures may betailored to define a desired configuration. For example, when it is notdesirable to allow a user to view through the three-dimensionalstructure, the apertures may be configured to define a non-linear paththere through, while still allowing for airflow and/or sound to travelthrough the apertures. Additionally, a desired ratio and configurationof negative space and positive space may be selected to define astructure having a desired level of lightness, stiffness, flexibility,and/or other characteristics, depending on the application thereof.Thus, for example, the three-dimensional structures may be employed ashousings for electronic devices and speaker or vent covers therefore.The three-dimensional structures may also be employed as springs or heatsinks, in various other embodiments thereof.

Other aspects and advantages of the present disclosure will becomeapparent from the following.

BRIEF DESCRIPTION OF THE DRAWINGS

Having thus described the disclosure in general terms, reference willnow be made to the accompanying figures, wherein:

FIG. 1A illustrates a sectional view through an example embodiment of athree-dimensional structure having first and second opposing surfacesdefining patterns of positive and negative space;

FIG. 1B illustrates a perspective sectional view through the exampleembodiment of the three-dimensional structure of FIG. 1A;

FIG. 2 illustrates a block diagram of an example embodiment of a methodfor forming a three-dimensional structure;

FIG. 3 illustrates a first surface of an example embodiment of athree-dimensional structure including the same pattern offset on twosides;

FIG. 4 illustrates a second surface of the three-dimensional structureof FIG. 3;

FIG. 5 illustrates an example embodiment of a three-dimensionalstructure that includes connecting members defining a box structure;

FIG. 6 illustrates a first surface of an example embodiment of aspherical three-dimensional structure;

FIG. 7 illustrates a side view of the three-dimensional structure ofFIG. 6;

FIG. 8 illustrates a first surface of an example embodiment of athree-dimensional structure defining a first pattern;

FIG. 9 illustrates a second surface of the three-dimensional structureof FIG. 8 defining a second pattern that is the inverse of the firstpattern;

FIG. 10 illustrates a first surface of an example embodiment of athree-dimensional structure defining a convex portion at the firstsurface;

FIG. 11 illustrates a second surface of the three-dimensional structureof FIG. 10 defining a concave portion at the second surface;

FIG. 12 illustrates a first surface of an example embodiment of athree-dimensional structure defining a plurality of curved portions;

FIG. 13 illustrates a side view of the three-dimensional structure ofFIG. 12;

FIG. 14 illustrates a first surface of an example embodiment of athree-dimensional structure wherein a pattern defined at the firstsurface does not extend to peripheral edges of the three-dimensionalstructure;

FIG. 15 illustrates a perspective view of an example embodiment of athree-dimensional structure wherein the patterns at the first surfaceand the second surface define a greater portion of negative space thanpositive space;

FIG. 16 illustrates an example embodiment of a three-dimensionalstructure wherein the first pattern and the second pattern are identicaland define smaller negative spaces at the center of thethree-dimensional structure than at the edges of the three-dimensionalstructure;

FIG. 17 illustrates an example embodiment of a three-dimensionalstructure comprising three-layers;

FIG. 18 illustrates an example embodiment of a three-dimensionalstructure defining apertures that extend at a plurality of anglestherethrough;

FIG. 19 illustrates an example embodiment of a three-dimensionalstructure that defines a housing for a portable electronic device inwhich positive spaces of first and second spaces of patterns define aspeaker cover;

FIG. 20 illustrates a cross-sectional view through an example embodimentof a three-dimensional structure in which an aperture defines a linearpath therethrough that is perpendicular to first and second opposingsurfaces;

FIG. 21 illustrates a cross-sectional view through an example embodimentof a three-dimensional structure in which an aperture defines a linearpath therethrough that is perpendicular to first and second opposingsurfaces and the aperture includes first and second portions havingdiffering dimensions;

FIG. 22 illustrates a cross-sectional view through an example embodimentof a three-dimensional structure in which the aperture extends at anon-perpendicular angle relative to the first and second surfaces anddefines a linear path therethrough;

FIG. 23 illustrates a cross-sectional view through an example embodimentof a three-dimensional structure in which the aperture includes firstand second portions that extend at different angles and intersect suchthat a non-linear path is defined therethrough; and

FIG. 24 illustrates a cross-sectional view through an example embodimentof a three-dimensional structure in which the aperture includes firstand second portions that extend at different angles and intersect suchthat a linear path is defined therethrough.

DETAILED DESCRIPTION

The present disclosure in one embodiment relates to three-dimensionalstructures. The three-dimensional structures may be formed by a varietyof methods according to additional embodiments of the disclosure. Forexample, the structures disclosed herein may be formed by etching (e.g.,chemical etching or laser etching), machining, casting, forging, orinjection molding. However, various other methods of forming thethree-dimensional structures may be employed in other embodiments.Further, multiple methods of forming the structures may be employed toform a single structure. For example, etching may be employed to form afirst surface of the structure, whereas machining may be employed toform a second surface of the structure. Thus, although the methodsdisclosed herein are generally discussed in terms of removing material,this need not be the case in all embodiments.

The present disclosure in one embodiment relates to three-dimensionalstructures. The three-dimensional structures may be formed by a varietyof methods according to additional embodiments of the disclosure. Forexample, the structures disclosed herein may be formed by etching (e.g.,chemical etching or laser etching), machining, casting, forging, orinjection molding. However, various other methods of forming thethree-dimensional structures may be employed in other embodiments.Further, multiple methods of forming the structures may be employed toform a single structure. For example, etching may be employed to form afirst surface of the structure, whereas machining may be employed toform a second surface of the structure. Thus, although the methodsdisclosed herein are generally discussed in terms of removing material,this need not be the case in all embodiments.

The various three-dimensional structures disclosed herein may bespecifically configured to define characteristics that are suitable forthe intended use of the structures. For example, lightweight structuresmay be formed by removing a significant portion of the body from whichthe three-dimensional structures are formed. Further, relatively strong,yet lightweight box-shaped structures may be formed by removing materialfrom both sides of a body such that the two sides are separated fromone-another, but connecting members may extend between the two surfacesto provide the three-dimensional structure with a desired amount ofstiffness. In another embodiment the three-dimensional structure may bedefined by removing material such that the structure is useable as aspring or a resilient member that may, for example, be employed to formprotective packaging. Accordingly, as described in greater detail below,the method disclosed herein may produce a large variety ofthree-dimensional structures that may be employed for a variety ofpurposes.

In this regard, FIGS. 1A and 1B illustrate an embodiment of athree-dimensional structure 10 that may be formed in accordance with themethods disclosed herein. FIG. 1A illustrates top, bottom, and sectionalviews through the three-dimensional structure 10. FIG. 1B illustrates aperspective sectional view through the three-dimensional structure 10.

The three-dimensional structure 10 may include a body defining first 10Aand second 10B opposing surfaces from which material is removed atnegative spaces 12A, 12B that extend into the material along respectiveaxes 13A, 13B. Further, material may be retained at positive spaces 14A,14B. As illustrated, the positive 14A, 14B and negative 12A, 12B spacesmay be provided in patterns at the first 10A and second 10B surfaces.

As illustrated in the cross-section through the three-dimensionalstructure 10, the negative spaces 12A of the first pattern may extendalong respective axes 13A from the first surface 10A into the body to adepth D1. Similarly, the negative spaces 12B of the second pattern mayextend along respective axes 13B from the second surface 10B into thebody to a depth D2. Although illustrated as such, the axes 13A of eachof the negative spaces 12A of the first pattern need not be parallel toone another or parallel to the axes 13B of each of the negative spaces12B of the second pattern in all embodiments.

Due to the relative positions of the first pattern of positive 14A andnegative 12A spaces relative to the second pattern of positive 14B andnegative 12B spaces, apertures 16 (e.g., through holes) may be definedthrough the three-dimensional structure 10 at the positions where thenegative spaces of the first and second patterns intersect. Thus, theapertures 16 may extend along axes 18 through the three-dimensionalstructure. In this embodiment, the axis 18 of each aperture 16 isperpendicular to the first surface 10A and the second surface 10B.

However, in other embodiments the axes of the apertures may extend atother angles relative to the surfaces of the three-dimensionalstructure. Further, in some embodiments the respective axes of thenegative spaces of the first pattern and the negative spaces of thesecond pattern may be non-parallel, such that apertures defined throughthe body do not extend along a single axis. Additionally, in someembodiments the negative spaces of the first pattern and the negativespaces of the second pattern may not intersect, such that there are notthrough holes extending completely through the thickness of the body.Elaborating discussion with respect to these additional embodiments isprovided below.

One example embodiment of a method for forming a three-dimensionalstructure is illustrated in FIG. 2. In this regard, the method mayinclude providing a body defining a first surface and a second surfaceat operation 100, removing a first portion of the material from the bodyto define a first pattern of a positive space and a negative space atthe first surface at operation 102, and removing a second portion of thematerial from the body to define a second pattern of a positive spaceand a negative space at the second surface at operation 104. Asillustrated at operation 106, the first pattern and the second patterncombine to form the three-dimensional structure.

Thus, in one example embodiment, the three dimensional structure may beformed by removing material from first and second surfaces of a body. Inthis regard, first and second surfaces, as used herein, refer tosurfaces at differing positions on a body. Thus, for example, a body inthe form of a sphere may be considered to define multiple surfaces, eventhough the sphere may as a hole define a single surface. Accordingly,providing a body at operation 100 is not restricted to any particularconfiguration.

The method may additionally include applying a surface finish to atleast one of the first surface and the second surface. The surfacefinish may include one or more known surfaces (e.g., polishing, sanding,anodizing, painting, and/or buffing). Applying the surface finish may beconducted prior to removing the portion of the material in someembodiments. For example, a surface finish may be applied to the firstsurface prior to removing a first portion of the material at operation102. Alternatively or additionally, a surface finish may be applied tothe second surface prior to removing a second portion of the material atoperation 104. In this regard, applying a surface finish prior toremoving material may be preferable in some embodiments in that thevarious methods for removing material disclosed herein (e.g., machining,chemical etching, and laser etching) may be configured to produce clean,relatively sharp edges at the transitions between the negative andpositive spaces. These transitions between the positive and negativespaces may for example, provide features that may be gripped by a userof a product, and/or which may be aesthetically pleasing. Conversely,removing the material may be conducted prior to applying a surfacefinish in other embodiments. This order of operations may be preferablewherein smoother transitions are preferable between the negative andpositive spaces.

With respect to removing a first portion of the material from the bodyto define a first pattern of a positive space and a negative space atthe first surface at operation 102 and removing a second portion of thematerial from the body to define a second pattern of a positive spaceand a negative space at the second surface at operation 104, positivespace, as used herein, refers to space in which the material definingthe body is retained. Conversely, negative space, as used herein, refersto the space at which material of the body is removed. Further, apattern, as used herein, refers to a regular or repetitive form, order,or arrangement of the positive and negative spaces.

As noted above, the first pattern and the second pattern combine to formthe three-dimensional structure. In this regard, the relationshipbetween the two patterns of positive and negative space causes thethree-dimensional structure to define a shape as a whole that differsfrom the initial shape of the body, the shape defined by the firstpattern alone, and the shape of the second pattern alone. Thus, thecombined result of applying the two patterns to the body is athree-dimensional structure with unique characteristics differing fromthe initial shape of the body, the shape defined by the first patternalone, and the shape of the second pattern alone.

Removing the first portion of the material at operation 102 and removingthe second portion of the material at operation 104 may take variousforms. For example, one or both of these operations 102, 104 may includelaser etching, machining, and/or chemical etching the body. As notedabove these, these embodiments may be combined in some embodiments. Forexample, the first surface may be laser etched at operation 102 and thesecond surface may be machined at operation 104. Further, multipleoperations may be applied to a single surface in some instances. Forexample, removing the first portion of the material at operation 102 mayinclude both laser and chemical etching. Additionally, removing thefirst portion of the material at operation 102 and removing the secondportion of the material at operation 104 may be conducted sequentially(e.g., one after the other) or simultaneously.

In one example embodiment, the three-dimensional structure is formed bychemical etching. In this embodiment, the method may include applying amask (e.g., a masking layer) to the first surface and applying a mask tothe second surface. Thus, a single mask may be applied to the body thatextends to both the first surface and the second surface, or multiplemasks may be employed to mask the first surface and the second surface.Various embodiments of masks may be employed. In one embodiment the maskmay include a tape, paint, an elastomer (e.g., rubber or neoprene), aplastic (e.g., polyvinyl chloride, polyethylene, or polystyrene) and/ora photo resist.

Chemical etching may also include applying an etchant to the firstsurface and applying an etchant to the second surface. The etchant maybe an acid, base, or any other chemical configured to remove materialfrom the body to define the negative space of the first surface and thenegative space of the second surface. Conversely, the mask and theetchant may be configured such that the mask substantially preventsremoval of the material at locations where the mask is positioned on thesurface of the body. Accordingly, the positive space of the firstsurface and the positive space of the second surface may substantiallycorrespond to the locations at which the mask is positioned on the firstsurface and the second surface.

The same etchant may be employed for both the first surface and thesecond surface in some embodiments, whereas different etchants may beemployed in other embodiments. Further, etchant may be applied to thefirst surface and the second surface simultaneously, or sequentially.The etchant may be applied to the body via a variety of methodsincluding, for example, spraying and/or immersion.

In some embodiments the etchant may remove material from the firstsurface and the second surface such that the negative spaces thereofextend to the same depth (see, e.g., D1 and D2 in FIG. 1A). However, inother embodiments the etchant may remove material such that the negativespaces extend to differing first and second depths. In this regard, asnoted above, in one embodiment different etchants may be applied to thefirst surface and the second surface. For example, the etchants may bedifferent chemicals, and/or different concentrations of the samechemical. Alternatively or additionally, the etchants may be heated todifferent temperatures and/or applied to the body for differing periodsof time to cause the negative spaces of the first surface and thenegative spaces of the second surface to extend into the body todiffering depths.

In some embodiments, removing the first portion of the material atoperation 102 and removing the second portion of the material atoperation 103 may include intersecting the negative space of the firstpattern with the negative space of the second pattern to define at leastone aperture (e.g., a through hole) that extends through the body fromthe first surface to the second surface. In this regard, the depth ofthe material removed from the first side and the second side may be suchthat the negative space of the first pattern and the negative space ofthe second pattern combine to form apertures through the body in someembodiments. Thus, the etchant applied to the first surface and theetchant applied to the second surface may be configured to extend tofirst and second depths such that the combined depth is at least equalto the thickness of the body. Accordingly, in embodiments in whichintersecting is desired, at a minimum the etchants may be configured toextend through the material to a combined depth equal to the thicknessof the body. However, in other embodiments, to ensure intersection, theetchants may be configured to extend to a combined depth that is greaterthan the thickness of the body.

In embodiments in which intersecting is desired, the etchants may beconfigured to extend to the same depth, or differing depths. For examplewhen the etchants extend to the same depth, each etchant may beconfigured to extend through about 50% to about 75%, through about 55%to about 65%, or extend through about 55%, of the thickness of the body.By way of further example, when the etchants extend to differing depths,a first etchant may be configured to extend through about 10% to about50%, though about 20% to about 40%, or through about 35% of thethickness of the body. Conversely, the second etchant may be configuredto extend through about 50% to about 90%, though about 60% to about 80%,or through about 70% of the thickness of the body. Further, the combinedthickness through which the etchant(s) are configured to extend,regardless of whether the first etchant and the second etchant areconfigured to extend to the same depth, may be from about 100% to about130%, from about 100% to about 120%, or about 110%.

In other embodiments, removing the first portion of the material atoperation 102 and removing the second portion of the material atoperation 104 may be conducted such that the negative space of the firstpattern and the negative space of the second pattern do not intersect.In this regard, in one embodiment the combined depth to which thenegative space of the first surface and the negative space of the secondsurface extend may be less than 100% of the thickness of the body.Alternatively, the combined depth to which the negative space of thefirst surface and the negative space of the second surface extend mayexceed 100% of the thickness of the body, but the negative spaces may beoffset such that they do not intersect.

Accordingly, a variety of three-dimensional structures may be formed inaccordance with embodiments of the methods disclosed herein. As notedabove, although the description of the methods for forming thethree-dimensional structures disclosed herein are generally describedwith respect to embodiments in which material is removed from a body, inother embodiments the three-dimensional structures may be formed byadding material. For example, the structures may be formed by molding orcasting, in which a mold or cast is employed to form thethree-dimensional structure from a fluid substance, such as a liquidmetal or plastic. In another embodiment, material defining a body may becompressed to form a desired three-dimensional shape by forging.

Accordingly, methods for forming three-dimensional structures areprovided. Means for forming three-dimensional structures are alsoprovided. The means for forming three-dimensional structures may includemeans for providing a body comprising a material defining a firstsurface and a second surface; means for removing a first portion of thematerial from the body to define a first pattern of a positive space anda negative space at the first surface; and means for removing a secondportion of the material from the body to define a second pattern of apositive space and a negative space at the second surface. Accordingly,as described above with respect to the method, the first pattern and thesecond pattern combine to form the three-dimensional structure. In thisregard, the means may include any of the above-described structures andassemblies, including lasers, machines, molding equipment, castingequipment, forging equipment, and chemical etching equipment such asmasks and etchants.

Further a non-transitory computer readable medium for storing computerinstructions executed by a processor in a controller for controlling anetching device. The non-transitory computer readable medium may includecomputer code for removing a first portion of a material from a body todefine a first pattern of a positive space and a negative space at afirst surface of the body. Further, the non-transitory computer readablemedium may include computer code for removing a second portion of thematerial from the body to define a second pattern of a positive spaceand a negative space at a second surface of the body, wherein the firstpattern and the second pattern combine to form the three-dimensionalstructure.

In some embodiments the computer code for removing the first portion ofthe material and the computer code for removing the second portion ofthe material includes computer code for intersecting the negative spaceof the first pattern with the negative space of the second pattern todefine at least one aperture that extends through the body from thefirst surface to the second surface. However, in other embodiments thecomputer code may be configured to cause the negative spaces to notintersect, as described above. Further, in some embodiments the etchingdevice may include a chemical etching device, and the computer code forremoving the first portion of the material and the computer code forremoving the second portion of the material includes computer code forapplying at least one mask to the first surface and the second surfaceand computer code for applying at least one etchant to the first surfaceand the second surface. In alternate embodiments the etching device mayinclude lasers, machinery (e.g., a mill), molding equipment, castingequipment, or forging equipment, and the controller may be a controllerconfigured therefore. Thus, the non-transitory computer readable mediummay include computer code for operating these various devices inaccordance with the methods disclosed herein.

The three-dimensional structures of the present disclosure may define avariety of shapes and configurations. In this regard, the embodimentsdisclosed herein are provided for example purposes only, and it shouldbe understood that the structures may define a variety of otherconfigurations within the scope of the disclosure. By way of example,FIGS. 3 and 4 illustrate a three-dimensional structure 200 in accordancewith one embodiment of the disclosure. FIG. 3 illustrates a firstsurface 200A of the three dimensional structure 200, whereas FIG. 4illustrates an opposing second surface 200B. As illustrated, the patterndefined in the first surface 200A of the three-dimensional structure 200is identical to the pattern defined in the second surface 200B of thethree-dimensional structure. However, as illustrated, the patterns aredisplaced relative to one another such that negative spaces 202A of thefirst pattern at the first side 200A align with positive spaces 204B ofthe second pattern at the second side 200B, and positive spaces 204A ofthe first pattern at the first side 200A align with negative spaces 202Bof the second pattern at the second side 200B. In other embodiments thepatterns may be shifted from alignment in other manners, such as viarotation of one pattern relative to the other about an angle. Thus,although apertures 206 extend through the material defining thethree-dimensional structure from the first surface 200A to the secondsurface 200B (due to intersection of the negative space 202A of thefirst pattern with the negative space 202B of the second pattern), theapertures are relatively smaller in area (individually and cumulatively)than the area of the negative space 202A defined by the first pattern orthe negative space 202B defined by the second pattern.

Variations of three-dimensional structures may be formed even when thesame patterns are applied to the first and second surfaces. In thisregard, for example, in the embodiment of the three-dimensionalstructure 200 illustrated in FIGS. 3 and 4, the first surface 200A andthe second surface 200B are relatively close to one another such thatthey are directly adjacent. However, as illustrated in FIG. 5, in oneembodiment of a three-dimensional structure 300, the first surface 300Aand the second surface 300B may be displaced from one another. In thisregard, the positive space 304A of the first pattern and/or the positivespace 304B of the second pattern may form one or more connecting members308, which connect the first surface 300A to the second surface 300B todefine a three-dimensional box shape. Accordingly, although the patternsemployed to form the three-dimensional structure 300 of FIG. 5 are thesame as the patterns employed to form the three-dimensional structure ofFIG. 4, the three-dimensional structures may differ.

By way of further example, FIGS. 6 and 7 illustrate an additionalembodiment of a three-dimensional structure 400 that employs the samepatterns as the three-dimensional structure of FIGS. 3 and 4. Asillustrated in FIG. 6, the patterns forming the three-dimensionalstructure 400 may be aligned in the same manner as the patterns formingthe three-dimensional structure 200 of FIGS. 3 and 4. However, asillustrated in FIG. 7, the first surface 400A and/or the second surface400B may be non-planar, in contrast to the planar surfaces 200A, 200Billustrated in FIGS. 3 and 4. Accordingly, the various embodiments ofthe three-dimensional structures described herein may be employed inconjunction with planar or non-planar surfaces.

FIGS. 8 and 9 illustrate an alternate embodiment of a three-dimensionalstructure 500 in which the first pattern at the first surface 500A isdifferent than the second pattern at the second surface 500B. Inparticular, the first pattern at the first surface 500A is the inverseof the second pattern at the second surface 500B. In this regard, thepositive space 504A at the first surface 500A may be substantially equalin size and/or shape to the negative space 502B of the second surface500B. Further, the negative space 502A of the first surface 500A may besubstantially equal in size and/or shape to the positive space 504B ofthe second surface 502A. In this embodiment, the patterns are positionedsuch that apertures 506 are defined through three-dimensional structure500 by the negative spaces 502A, 502B of the first and second patterns.

Additionally, a projected area of the negative space 502A defined by thefirst pattern is less than a projected area of the negative space 502Bdefined by the second pattern. Conversely, a projected area of thepositive space 504B defined by the first pattern is greater than aprojected area of the positive space 504B defined by the second pattern.However, in other embodiments the projected areas of the first surfaceand the second surface may be equal, or the second surface may include anegative space that defines a projected area that is less than that ofthe first surface and the second surface may include a positive spacethat defines a projected area that is greater than that of the firstsurface.

FIGS. 10 and 11 illustrate an additional embodiment of athree-dimensional structure 600. As illustrated, the first surface 600Adiffers from the second surface 600B in that part of the first surfacedefines a convex configuration, whereas part of the second surfacedefines a convex configuration. The three-dimensional structure 600includes the same pattern applied to both the first surface 600A and thesecond surface 600B. In this regard, the three-dimensional structure 600of FIGS. 10 and 11 demonstrates that the same pattern may be applied tothe first and second surfaces even when the first and second surfacesdefine differing surface configurations (e.g., planar versus non-planar,convex versus concave, etc.).

The first pattern and the second pattern are offset such that thepositive spaces 604A at the first surface 600A align with the negativespaces 602B at the second surface 600B and the negative spaces 602A atthe first surface align with the positive spaces 604B at the secondsurface. This configuration defines apertures 606 therethrough. Further,the pattern employed to form the three-dimensional structure 600 ofFIGS. 10 and 11 is substantially the inverse of the pattern employed toform the three-dimensional structure 200 of FIGS. 3 and 4.

Note that since the same pattern is employed at both the first surface600A and the second surface 600B, the projected area of the negativespace 602A defined by the first pattern is substantially equal to aprojected area of the negative space 602B defined by the second pattern.Further, a projected area of the positive space 604B defined by thefirst pattern is substantially equal to a projected area of the positivespace 604B defined by the second pattern (e.g., perpendicular to thesecond surface 600B). There may be slight variations in the projectedareas defined by the first surface 600A and the second surface 600B dueto the offset between the first pattern and the second pattern cuttingoff the patterns at the edges thereof at differing points.

FIGS. 12 and 13 illustrate an additional embodiment of athree-dimensional structure 700. As illustrated, the three-dimensionalstructure may define more complex shapes than the three-dimensionalshapes previously described. In this regard, the positive space 704A atthe first surface 700A may cooperate with the negative space 702B at thesecond surface 700B to define curved, “sail-shaped,” structures. In thisregard, for example, a body defining one or more planar surfaces may bemachined, etched, or otherwise processed to define a variety of curvedor angular surfaces. In other embodiments, the body may initially definea non-planar configuration with the processing operations (e.g., removalof material from the first surface at operation 102 or removal ofmaterial from the second surface at operation 104) thus involvingremoval of material from the non-planar body to define complex shapes.As also described herein, injection molding, casting, forging, or otherprocesses by which material is combined or shaped may be employed toform the three-dimensional structure.

FIG. 14 illustrates another embodiment of a three-dimensional structure800. This three-dimensional structure 800 illustrates that the patternsapplied to the surfaces need not extend all the way to the peripheraledges 810 of the three dimensional structured. In this regard, theperipheral edges 810 of the three-dimensional structure 800 may retainthe initial configuration of the body to which the patterns are appliedin some embodiments. In other embodiments the patterns may be applied torelatively smaller portions of the first surface and/or the secondsurface, depending on the desired resulting three-dimensional structure.

FIG. 15 illustrates an embodiment of a three-dimensional structure 900in which the negative space 902A at the first surface 900A and thenegative space 902B at the second surface 900B is greater than thepositive space 904A at the first surface and the positive space 904B atthe second surface. In this regard, the patterns employed herein may beconfigured as desired to produce three-dimensional structures havingrelatively large portions of material, or relatively small portions ofmaterial.

By way of further example, FIG. 16 illustrates an embodiment of a threedimensional structure 1000 in which the negative space is relativelyless than the positive space. Further, the three-dimensional structure1000 illustrates that the patterns may vary across the surfaces. Forexample, in the illustrated embodiment the spacing of each of thenegative spaces 1002A is the same across the first surface 1000A, butthe dimensions of each of the negative spaces decreases at the center ofthe first surface and increases toward the peripheral edges 1010 of thefirst surface. Thus, the apertures 1006 through the three-dimensionalstructure vary in size (e.g., area) across the surface of the structure,with the center of the three-dimensional structure 1000 defining smallerapertures therethrough. The size of the positive and negative spaces mayvary in other manners in other embodiments.

Embodiments in which the size of the negative space varies across thesurfaces of the three-dimensional structure may be configured for use inembodiments in which varying optical, thermal, or acoustical propertiesare desirable. For example, larger apertures (defined by the negativespaces) may be employed at positions where greater heat transfer (and/oroptical or acoustical transmission) is desirable, and the smaller spacesmay be configured to correspond with areas in which less heat transfer(and/or optical or acoustical transmission) is desirable. Accordingly,the patterns may be configured to provide varying characteristicsdepending on the application thereof.

Note further that FIG. 16 illustrates an embodiment in which the secondpattern at the second surface (not illustrated) is identical to thefirst pattern and aligned therewith. Accordingly, the apertures 1006defined through the three-dimensional structure 1000 correspond in sizeand position to the negative space 1002A of the first surface 1000A andin size and position to the negative space of the second surface (notshown).

FIG. 17 illustrates an embodiment in which the three-dimensionalstructure 1100 is formed from multiple layers of material. Inembodiments in which the three-dimensional structure 1100 is formed byremoval of material, the layers may be attached prior to removal of thematerial, or the layers may be attached after removal of material. Inthe illustrated embodiment, the three-dimensional structure 1100includes three layers 1112, 1114, 1116. The first layer 1112 may definethe first surface 1100A, the third layer 1116 may define the secondsurface (not shown), and an intermediate layer 1114 may be positionedbetween the first layer 1112 and the third layer 1116. In theillustrated embodiment the intermediate layer 1114 corresponds in sizeand shape to an aggregate pattern of the first pattern and the secondpattern employed to form the three-dimensional structure 1100. In thisregard, the intermediate layer 1114 defines positive space where one orboth of the first pattern and the second pattern defines positive space,and the intermediate layer defines negative space where both the firstpattern and the second pattern define negative space. However, variousother configurations may be employed in other embodiments.

FIG. 18 illustrates an additional embodiment of a three-dimensionalstructure 1200. The three-dimensional structure 1200 includes first andsecond patterns of positive negative spaces in forms that overlaprelative to one another such that the apertures 1206 extend throughthree-dimensional structure at varying angles. In this regard, the viewthrough the three-dimensional structure at any given angle is restrictedto views through the apertures 1206 that align with the perspective ofthe user.

The three-dimensional structures described herein as well as the methodsfor forming the three-dimensional structures may be employed in avariety of applications. In this regard, FIG. 19 illustrates one exampleembodiment in which the body of the three-dimensional structure definesa housing 1300 for a portable electronic device. In this regard, thefirst surface 1300A of the three-dimensional structure may define anouter surface of the housing 1300, and the second surface (not shown)may define an inner surface of the three dimensional structure. Further,in some embodiments the positive space 1304A of the first pattern andthe positive space 1304B of the second pattern may define a speakercover, as illustrated. In this regard, the negative space 1302B of thesecond pattern may be configured to define relatively small apertures1306 through the housing 1300 which allow sound to travel therethrough,but which are configured to prevent dust and other debris from travelingtherethrough to protect the internal components of the portableelectronic device. Thus, for example, the three-dimensional structuresdisclosed herein may provide multiple functions in a single-piecestructure. In contrasts, other methods of forming structures withsimilar characteristics may involve attaching two separate structures(e.g. a housing and a screen), which may involve additional complexityand costs.

As noted above, in some embodiments the first pattern of positive andnegative space and the second pattern of positive and negative space maybe configured such that the negative space of the first patternintersects the negative space of the second pattern to define aperturesthrough the three-dimensional structure. In this regard, FIGS. 20-24illustrate example configurations of apertures that may result from theintersection of negative spaces. For example, FIG. 20 illustrates apartial cross-sectional view through a three-dimensional structure 1400defining an aperture 1406 therethrough.

As illustrated, the aperture 1406 may be configured such that it issubstantially uniform in width in some embodiments. Thus, although afirst portion of the aperture 1406 may be defined by the negative space1402A of the first pattern and a second portion of the aperture may beformed by the negative space of the second pattern, these portions maybe indistinguishable due to the two portions defining the same width andextending along the same axis 1418. Further, the aperture 1406 may beconfigured to extend substantially perpendicular to the first surface1400A and/or the second surface 1400B. As further illustrated, a linearpath may be defined through the three-dimensional structure 1400 alongthe axis 1418 of the aperture 1406.

Apertures that define linear paths therethrough may be employed inapplications of the three-dimensional structures in which it isdesirable to allow a view therethrough. In this regard, by providing alinear path 1406 through the three-dimensional structure 1400, a usermay be able to see through the three-dimensional structure at eachaperture 1406. In the embodiment illustrated in FIG. 20, the aperture1406 defines linear paths therethrough, including one linear path alongthe axis 1418 that is perpendicular to the first surface 1400A and thesecond surface 1400B.

FIG. 21 illustrates a partial cross-section through an additionalembodiment of a three-dimensional structure 1500. As was the case in thepreviously discussed embodiment of a three-dimensional structure 1400,the three-dimensional structure 1500 of FIG. 21 also defines a linearpath through an aperture 1506 along an axis 1518 that extendsperpendicularly to the first surface 1500A and the second surface 1500B.However, the aperture 1506 of the three-dimensional structure 1500 ofFIG. 21 includes a first portion 1506A and a second portion 1506B thatdefine differing dimensions. In this regard, the negative space 1502A ofthe first pattern may be relatively larger than the negative space 1502Bof the second pattern. For example, the housing 1300 in FIG. 19 shows anembodiment in which the negative spaces 1302A of the first pattern arelarger in area than the negative spaces 1302B of the second pattern. Inthis regard, as described above, the first pattern at the outer surfacemay be configured to provide a desirable aesthetic configuration and/orprovide a configuration that is easy for a user to grip or defines otherdesirable properties, whereas the second pattern may define relativelysmaller negative spaces that block dust from traveling into the portableelectronic device.

FIG. 22 illustrates a cross-sectional view through an additionalembodiment of a three-dimensional structure 1600 in which a linear pathis defined through the body along an axis 1618. However, unlike theembodiments of the three-dimensional structures 1400, 1500 illustratedin FIGS. 20 and 21, the axis 1618 of the aperture 1606 through thethree-dimensional structure 1600 of FIG. 22 is not perpendicular to thefirst surface 1600A or the second surface 1600B. In this regard, in someembodiments the aperture through the three-dimensional structure mayextend along an axis defining an angle with respect to one or both ofthe first surface and the second surface. Accordingly, although a linearpath is defined through the three-dimensional structure 1600, whenviewed from a perspective perpendicular to one of the surfaces 1600A,1600B, it may not be possible to see through the three-dimensionalstructure. This embodiment of apertures may be preferable when it isdesirable to prevent a user from seeing through the three-dimensionalstructure except from an angle substantially corresponding to the angleof the axis upon which the aperture extends.

In some embodiments the three-dimensional structure 1600 may be employedas part of a system that further includes a component 1620. Thecomponent 1620 may be, for example, a fan configured to direct airthrough the aperture 1606 or a speaker configured to direct soundthrough the aperture. As further illustrated in FIG. 22, in someembodiments the component 1620 may be configured to output emissions1622 (e.g., sound or airflow) in a direction that is substantiallyparallel to the axis 1618 of the aperture 1606. In this regard, theangle of the axis 1618 of the aperture 1606 may be employed to concealthe component 1620 from view at a normal angle relative to one or bothof the surfaces 1600A, 1600B while still allowing for acoustical orthermal transfer therethrough.

FIG. 23 illustrates a partial cross-sectional view through an additionalembodiment of a three-dimensional structure 1700. As illustrated, insome embodiments a first portion 1706A and a second portion 1706B of anaperture 1706 defined through the three-dimensional structure 1700 mayextend along non-parallel axes 1718A, 1718B. Accordingly, asillustrated, in some embodiments a linear path may not be definedthrough the three-dimensional structure. Instead, a non-linear path(e.g., along the first axis 1718A and the second axis 1718B) may bedefined through the three-dimensional structure 1700.

In this regard, the embodiment of the three-dimensional structure 1700illustrated in FIG. 22 may include apertures 1706 that may, for example,allow for the transmission of heat sound, or airflow therethrough.However, since no linear path is defined therethrough, transmission oflight through the aperture 1706 may be prevented or reduced depending onthe properties of the material defining the three-dimensional body(e.g., depending on the reflectivity of the material). Accordingly, thisembodiment may be employed when it is undesirable to allow a user to seethrough the aperture 1706 regardless of the angle at which the user isviewing the aperture. However, airflow may still occur through theaperture 1706 and/or sound may transmit therethrough.

As illustrated in FIG. 24, in another embodiment of a three-dimensionalstructure 1800 that includes apertures 1806 therethrough having first1806A and second 1806B portions that extend along first 1718A and second1718B axes that are not parallel, a linear path may still be definedtherethrough. In this regard, as illustrated, a linear path may extendalong an axis 1818 that is perpendicular to one or both of the first1800A and second 1800B surfaces.

Similarly, although the embodiment of the three-dimensional structure1600 illustrated in FIG. 22 does not include a linear path therethroughthat is perpendicular to the first surface 1600A or the second surface1600B, in other embodiments this may not be the case. For example, ifthe width of the aperture 1606 is sufficiently large, a linear path maybe defined therethrough. For example, the aperture may be configured inaccordance with either the first portion 1806A or the second portion1806B of the aperture 1806 illustrated in FIG. 24, which each define alinear path therethrough perpendicular to the first 1800A and second1800B surfaces.

Accordingly, the apertures may be specifically tailored to define alinear path or a non-linear path therethrough. The linear path may beperpendicular to one or both of the first and second surfaces, or at anangle to one or both of the first and second surfaces. Thus, the methodsand three-dimensional structures may define a variety of configurationsaccording the embodiments disclosed herein.

Further, the three-dimensional structures disclosed herein may beemployed for a variety of purposes. For example, as noted above, thethee-dimensional structures may be employed as housings for electronicdevices. In other embodiments the three-dimensional structures maydefine heat sinks. In this regard, the three-dimensional structuresdisclosure herein may be configured to define large surface areas, whichmay efficiently radiate heat. Further, in other embodiments thethree-dimensional structures may be configured as springs, and thestiffness thereof may be configured as desired. In this regard,depending on the material employed, the negative spaces of the patternsmay provide the three-dimensional structures with the ability to stretchand/or compress under load.

Further, the particular properties of the three-dimensional structuresmay be adjusted. For example, surface area, size and position ofapertures (if any), etc. may be adjusted to form the desiredthree-dimensional structure. In some embodiments the negative spaces ofthe patterns may be employed to create relatively lightweightstructures. Further, the patterns employed in the three-dimensionalstructures may be configured to create aesthetically pleasingstructures. Accordingly, the properties of the three-dimensionalstructures disclosed herein may be adjusted to suit the particularapplication for which the structures are intended.

Many modifications and other embodiments of the disclosure set forthherein will come to mind to one skilled in the art to which thedisclosure pertains having the benefit of the teachings presented in theforegoing descriptions. Therefore, it is to be understood that thedisclosure is not to be limited to the specific embodiments disclosedand that modifications and other embodiments are intended to be includedwithin the scope of the appended claims. Although specific terms areemployed herein, they are used in a generic and descriptive sense onlyand not for purposes of limitation. cm 1-25. (canceled)

26. A three-dimensional structure, comprising: a body having a firstsurface and a second surface, the first surface defining a first patternof negative spaces that extend into and are further defined by the body,and the second surface defining a second pattern of negative spaces thatextend into and are further defined by the body; and the body furtherdefining a combined negative space including each negative space of thefirst pattern of negative spaces in communication with each negativespace of the second pattern of negative spaces.
 27. Thethree-dimensional structure of claim 26, wherein: the first surface andthe second surface are located at different positions on the body; andthe first surface opposes the second surface.
 28. The three-dimensionalstructure of claim 26, wherein the body obstructs a line of sightthrough the combined negative space.
 29. The three-dimensional structureof claim 26, wherein the three-dimensional structure forms a part of ahousing for an electronic device.
 30. The three-dimensional structure ofclaim 26, wherein the body comprises a metal.
 31. The three-dimensionalstructure of claim 26, wherein the first pattern of negative spaces onthe first surface has a same spatial arrangement as the second patternof negative spaces on the second surface.
 32. The three-dimensionalstructure of claim 26, wherein the first pattern is offset from thesecond pattern.
 33. The three-dimensional structure of claim 26, whereinthe first pattern and the second pattern are regular and repeatingpatterns.
 34. The three-dimensional structure of claim 26, wherein thenegative spaces of the first pattern have substantially a same shape andsize as the negative spaces of the second pattern.
 35. A housing for anelectronic device, comprising: a body including a first surface defininga first pattern of openings, and a second surface defining a secondpattern of openings; the body defining: a first pattern of negativespaces in communication with the first pattern of openings, extendinginto the body along a first axis; and a second pattern of negativespaces in communication with the second pattern of openings, extendinginto the body along a second axis; and wherein the first and second axesare offset and the negative spaces of the first pattern of negativespaces intersect with the negative spaces of the second pattern ofnegative spaces to form a plurality of apertures defined by the body.36. The housing of claim 35, wherein the first surface opposes thesecond surface.
 37. The housing of claim 35, wherein the body comprisesa metal.
 38. The housing of claim 35, wherein the first pattern ofopenings is the same as the second pattern of openings.
 39. The housingof claim 35, wherein the first pattern of openings and the secondpattern of openings are regular and repeating patterns.
 40. The housingof claim 35, wherein the body further defines an internal negative spacearea including each negative space of the first pattern of negativespaces being in communication with each negative space of the secondpattern of negative spaces.
 41. The housing of claim 35, wherein thefirst pattern of negative spaces and the second pattern of negativespaces are regular and repeating patterns.
 42. The housing of claim 41,wherein the negative spaces of the first pattern have substantially asame shape and size as the negative spaces of the second pattern.
 43. Athree-dimensional structure, comprising: a body including a firstsurface and a second surface, the second surface being at a differentposition on the body than the first surface; the body defining acombined negative space forming a first pattern of openings on the firstsurface and a second pattern of openings on the second surface, thefirst pattern of openings being offset relative to the second pattern ofopenings.
 44. The three-dimensional structure of claim 43, wherein thefirst pattern of openings on the first surface has a same spatialarrangement as the second pattern of openings on the second surface. 45.The three-dimensional structure of claim 43, wherein the first patternof openings and the second pattern of openings are regular and repeatingpatterns.